Free CompTIA A+ 220-1101 Practice Question

When installing a new CPU or cleaning a computer case as part of regular maintenance, where is thermal compound applied?

  • Between the CPU and the socket.

  • Between the CPU and heat sink.

  • Inside each heat sink mounting point on the motherboard.

  • Between the fan and the heat sink fins.

Subscribe to avoid duplicate questions and track your progress over time

Your Score:
Hardware
Networking
Virtualization and Cloud Computing
Hardware and Network Troubleshooting
Mobile Devices
CompTIA A+ 220-1101
  • Mobile Devices
  • Networking
  • Hardware
    • This question is filed here
  • Virtualization and Cloud Computing
  • Hardware and Network Troubleshooting