Which cooling mechanism is capable of achieving the lowest operating temperatures for high-performance internal PC components?
Heat Sinks
Liquid Cooling
Fans
Thermal Paste
Liquid cooling is the most effective solution for dissipating heat from PC components, generally resulting in lower operating temperatures than air cooling. While typically more expensive and complex to install, it is the preferred choice for high-performance and overclocked systems. Fans and heat sinks are the primary components of an air cooling system, and thermal paste is a thermal interface material required to ensure proper heat transfer to either a liquid or air cooler.
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