Crucial Exams

CompTIA A+ 220-1101 (V14) Practice Question

Which of the following best describes the function of thermal paste commonly applied between the processor die and the base of a cooler or fan?

  • To enhance the electrical connectivity for signal transfer between the die and the cooler

  • To improve the conduction of energy for more efficient cooling

  • To insulate the die and prevent heat from reaching the cooler

  • To create a permanent bond restricting movement between the die and the cooler

CompTIA A+ 220-1101 (V14)
Hardware
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